SemiPOL High Precision Quantitative Grinding Machine
Product Description
SemiPOL enables precise grinding and polishing of various materials (optical lenses, semiconductor wafers, metal and non-metal crystal phases) for microscope (SEM, FIB, TEM, etc.) analysis. The target accuracy is micron level. It is mainly used for parallel grinding and polishing. Combined with more accessories, it can make the grinding and polishing of complex special-shaped parts and surfaces easier.