Search
English

Language

+86-138-1482-9868

Before you start shopping

We use first- and third-party cookies including other tracking technologies from third party publishers to give you the full functionality of our website, to customize your user experience, perform analytics and deliver personalized advertising on our websites, apps and newsletters across internet and via social media platforms. For that purpose, we collect information about user, browsing patterns and device.

By clicking "Accept All Cookies", you accept this, and agree that we share this information with third parties, such as our advertising partners. If you prefer, you can choose to continue with "Only Required Cookies". But keep in mind that blocking some types of cookies may impact how we can deliver tailored content that you might like.

For more information and to customize your options, click on "Cookie settings". If you want to learn more about cookies and why we use them, visit our Cookie Policy page at any time. Cookie Policy

Accept All Cookies Close

News

Home / News / Products News / SemiPOL high-precision quantitative grinding and polishing machine opens up a new level of high-precision quantitative grinding and polishing!

Home / News / Products News / SemiPOL high-precision quantitative grinding and polishing machine opens up a new level of high-precision quantitative grinding and polishing!

SemiPOL high-precision quantitative grinding and polishing machine opens up a new level of high-precision quantitative grinding and polishing!

SemiPOL high-precision grinding and polishing equipment can perform precise semi-automatic sample preparation for various materials, and can carry out high-precision grinding and polishing for various materials such as integrated circuits, semiconductor chips, optical components and optical fibers, petrographic phases, precision metal parts, etc. The processed materials can be directly used for microscopic analysis such as SEM, FIB, TEM, etc. Its target accuracy can reach the micron level, and it is mainly used in high-precision plane quantitative thinning operation scenarios. In addition, by matching with more accessories and fixtures, it can more easily and conveniently achieve grinding and polishing of complex and special-shaped surfaces. The equipment has the following features:

Grinding disc size: 8" (Φ203mm) or 10" (Φ254mm), flatness <2μm; Grinding disc speed: 0-350rpm, forward/reverse;
Blockage and drainage 10mm, resolution 1um, stable accuracy ±2um;
Can save 16 sets of commonly used grinding and polishing process parameters;
Large-diameter side-discharge water outlet, not easy to block and drain quickly;
Plug-in faucet design, convenient for cleaning and maintenance inside the disc.

PREV：Production Technology and Metallographic Analysis of Ancient Iron Axe
NEXT：How does MA-2275 mineral-filled melamine resin improve hardness and wear resistance?

Recommended