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DR Diamond Resin Bond Wafering Blade
Product Description
Wafering blades have very thin cut Width,are recommended for precision cutting/...
There are many different kinds of diamond wafering blades. Those that are best suited for cutting metals, plastics, polymers, and plowing materials should have high diamond concentrations. This is because they will break work-hardened strips, resulting in minimal deformation. However, larger diamond particles might be more suitable for certain materials, but smaller diamonds may not be economically viable. However, they can be more effective when a high level of deformation is required.
Precision diamond dicing blades for optimum performance, while sintered diamond wafering blades will cut brittle materials. In addition to being harder, these blades feature a higher abrasion resistance, and are more thermoconductive. Therefore, they are an excellent choice for a variety of cutting applications.
High-concentration diamond wafering blades are designed for hard and brittle materials. High concentration blades are most suitable for cutting most metals, while low-concentration blades are best suited for brittle materials. High-concentration diamond wafering blades can be used on a wide range of materials. A high-quality blade can be bought online from various manufacturers. It can also be used to make precise sections of a variety of materials.
A high-quality diamond wafering blade can be made out of two different materials: carbide or diamond. A carbide or diamond wafering blade can cut any type of material, from wood to ceramic.
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